TechConnect World Innovation Conference Invites Submissions

December 14th, 2015 by Sarah Ricard

The 2016 TechConnect World Innovation Conference will take place May 22-25 at the Gaylord Convention Center in Washington D.C. This annual event is designed to help speed up the commercialization of innovations out of the lab and into industry.

TechConnect World is looking for technology innovation submissions for the conference that are ready for licensing, corporate partnering, or investment opportunities. To participate, submit your detailed innovation description online by Jan. 22 for review by the TechConnect Accelerator Committee.

No fee is required for submission; however, if accepted, there is a $1,000 showcase fee that includes one conference registration and showcase booth.

Participants include universities, national and federal labs, SBIR Phase II awardees, public and private research institutions, corporate research divisions, and early stage companies.  See 2015 Innovation Showcase Participants.

Click here for more information on innovation submissions.