TechConnect World Innovation Conference Invites Submissions
December 14th, 2015 por Sarah Ricard
El 2016 Conferencia Mundial de la Innovación TechConnect will take place May 22-25 at the Gaylord Convention Center in Washington D.C. This annual event is designed to help speed up the commercialization of innovations out of the lab and into industry.
TechConnect World is looking for technology innovation submissions for the conference that are ready for licensing, corporate partnering, or investment opportunities. Para participar, submit your detailed innovation description online by Jan. 22 for review by the TechConnect Accelerator Committee.
No fee is required for submission; sin embargo, if accepted, hay una $1,000 showcase fee that includes one conference registration and showcase booth.
Participants include universities, laboratorios nacionales y federales, SBIR Phase II awardees, public and private research institutions, corporate research divisions, and early stage companies. Ver 2015 Innovation Showcase Participants.
haga clic aquí for more information on innovation submissions.